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WBNCSAC32

WBNCSAC32

LEAD FREE NO-CLEAN FLUX CORE SIL

WBNCSAC32

WBNCSAC32

Image is for reference, please contact us to get the real picture

Part No :

WBNCSAC32

Manufacturer
SRA Soldering Products
Description
LEAD FREE NO-CLEAN FLUX CORE SIL
Catalog
Solder
Availability
247224 pieces
Shipped from
HK warehouse
Expected Shipping Date
Jan 04 - Jan 08 2025
Type Description
Series:-
Package:Spool
Part Status:Active
Type:Wire Solder
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:0.032" (0.81mm)
Melting Point:430°F (221°C)
Flux Type:No-Clean
Wire Gauge:20 AWG, 21 SWG
Process:Lead Free
Form:Spool, 1 lb (454 g)
Shelf Life:-
Shelf Life Start:-
Storage/Refrigeration Temperature:-
WBNCSAC32 is available at GangBo-ic.com, Please review product page below for detailed information, including WBNCSAC32 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for WBNCSAC32 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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