SOLDER PASTE NO CLEAN T5 10CC
CMC 3.3MH 4A 2LN TH
Type | Description |
---|---|
Series: | - |
Package: | Syringe |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Leaded |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
NC191LT500CChip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
24-7068-7610Kester |
SOLDER FLUX-CORED/275 .020" 1LB |
|
14-7080-1001Kester |
SOLDER SOLID WIRE .093" 1LB SPL |
|
WBRASAC20-4OZSRA Soldering Products |
WIRE SOLDER , ROSIN ACTIVATED, S |
|
18-7000-0078Kester |
SOLDER SOLID WIRE .078" 20LB SPL |
|
70-1003-0510Kester |
SOLDER PASTE WATER SOLUBLE 500GM |
|
NC191LTA50Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
SMD3SWLT.040 10GChip Quik, Inc. |
SN42/BI58 2.2% FLUX CORE SOLDER |
|
70-1506-1510Kester |
SOLDER PASTE NO CLEAN 500GM |
|
70-4021-0919Kester |
SOLDER PASTE NO CLEAN 750GM |
|
SMD291SNLT7Chip Quik, Inc. |
SOLDER PASTE NO CLEAN LEAD-FREE |
|
70-4823-0910Kester |
NP560 SN96.5AG3.0CU0.5 T4 500 G |
|
BARSN62PB36AG2Chip Quik, Inc. |
SOLDER BAR SN62/PB36/AG2 1LB SUP |