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PA0170

PA0170

MINI SOIC-8 EXP PAD TO DIP-8 SMT

PA0170

PA0170

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Part No :

PA0170

Manufacturer
Chip Quik, Inc.
Description
MINI SOIC-8 EXP PAD TO DIP-8 SMT
Catalog
Adapter, Breakout Boards
Availability
059105 pieces
Shipped from
HK warehouse
Expected Shipping Date
May 09 - May 13 2024
PDF
PA0170 PDF
Type Description
Series:Proto-Advantage
Package:Bulk
Part Status:Active
Proto Board Type:SMD to DIP
Package Accepted:MiniSOIC EP
Number of Positions:8
Pitch:0.026" (0.65mm)
Board Thickness:0.062" (1.57mm) 1/16"
Material:FR4 Epoxy Glass
Size / Dimension:0.700" x 0.400" (17.78mm x 10.16mm)
PA0170 is available at GangBo-ic.com, Please review product page below for detailed information, including PA0170 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for PA0170 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

  • Please confirm the specifications of the products when ordering.
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  • If you have special order instructions,please note it on the ordering pages.
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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
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