HEAT SINK EXPERIMENT KIT
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Kit Type: | Physical Science |
Main Purpose: | Thermal Transfer |
Interconnect System: | - |
Suggested Programming Environment: | - |
Utilized IC / Part: | - |
Included MCU/MPU Board(s): | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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