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SM662GEB BDS ST602

SM662GEB BDS ST602

FERRI EMMC 10GB 3D TLC + EXT. TE

SM662GEB BDS ST602

SM662GEB BDS ST602

Image is for reference, please contact us to get the real picture

Part No :

SM662GEB BDS ST602

Manufacturer
Silicon Motion
Description
FERRI EMMC 10GB 3D TLC + EXT. TE
Catalog
Memory
Availability
342534 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 26 - Nov 30 2024
Type Description
Series:Ferri-eMMC®
Package:Tray
Part Status:Active
Memory Type:Non-Volatile
Memory Format:FLASH
Technology:FLASH - NAND (TLC)
Memory Size:-
Memory Interface:eMMC
Clock Frequency:-
Write Cycle Time - Word, Page:-
Access Time:-
Voltage - Supply:-
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:153-TFBGA
Supplier Device Package:153-BGA (11.5x13)
SM662GEB BDS ST602 is available at GangBo-ic.com, Please review product page below for detailed information, including SM662GEB BDS ST602 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SM662GEB BDS ST602 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

  • Please confirm the specifications of the products when ordering.
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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
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