WAFER (UNSAWN) - BOX
Type | Description |
---|---|
Series: | * |
Package: | Tray |
Part Status: | Active |
Type: | - |
Input Type: | - |
Output Type: | - |
Current - Supply: | - |
Operating Temperature: | - |
Mounting Type: | - |
Package / Case: | - |
Supplier Device Package: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
UPD8834AD-ARochester Electronics |
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IC RESISTIVE STRAIN GAUGE 40QFN |
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ZSSC3018BA2CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSC31015EECRenesas Electronics America |
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PT8A2541WEXZetex Semiconductors (Diodes Inc.) |
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MAX14540AEEWP+TMaxim Integrated |
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LT1025CJ8Linear Technology (Analog Devices, Inc.) |
T.C. COLD JUNCTION COMPENSATOR |
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PIR CONTROLLER |
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XR15715MaxLinear |
SENSOR INTERFACE |
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RE46C803E16FRoving Networks / Microchip Technology |
IC CO DETECTOR 16DIP |
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ZSSC3240AI3R ESRenesas Electronics America |
IC SENSOR SIGNAL CONDITIONER |
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ZSSC3026CI1D ESRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |