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ZSC31050FID

ZSC31050FID

DICE (WAFER SAWN) - WAFFLE PACK

ZSC31050FID

ZSC31050FID

Image is for reference, please contact us to get the real picture

Part No :

ZSC31050FID

Manufacturer
Renesas Electronics America
Description
DICE (WAFER SAWN) - WAFFLE PACK
Catalog
Interface - Sensor and Detector Interfaces
Availability
371837 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
Type Description
Series:*
Package:Tray
Part Status:Active
Type:-
Input Type:-
Output Type:-
Current - Supply:-
Operating Temperature:-
Mounting Type:-
Package / Case:-
Supplier Device Package:-
ZSC31050FID is available at GangBo-ic.com, Please review product page below for detailed information, including ZSC31050FID price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for ZSC31050FID to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

  • Please confirm the specifications of the products when ordering.
  • MOQ means the minimum order quantity required to purchase each parts.
  • If you have special order instructions,please note it on the ordering pages.
  • The Pre-Shipment Inspection (PSI) will be applied.
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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
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  • ZSC31050FID Price
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  • ZSC31050FID Datasheet
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  • ZSC31050FID Features
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