DICE (WAFER SAWN) - FRAME
Type | Description |
---|---|
Series: | * |
Package: | Tray |
Part Status: | Active |
Type: | - |
Input Type: | - |
Output Type: | - |
Current - Supply: | - |
Operating Temperature: | - |
Mounting Type: | - |
Package / Case: | - |
Supplier Device Package: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ZSSC3026CC1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3154BA1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3131BA1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3135BE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSC31014EICRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSC31010CEBRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
XTR105TDC2Texas Instruments |
IC CRNT TRANSMITTER 14SOIC |
|
STB-TCIRochester Electronics |
ANALOG SIGNAL CONDITIONING |
|
ZSSC3018BA2BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSC31050FIDRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
TDC-GP30YA 1KScioSense |
TDC-GP30YA 1K QFN40 LF T&R |
|
ZSSC3138BA1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3138BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |