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LAPPING FILM ALUMINUM OXIDE

BCM3384DIFSBG

BCM3384DIFSBG

CABLE MODEM

BCM3384DIFSBG

BCM3384DIFSBG

Image is for reference, please contact us to get the real picture

Part No :

BCM3384DIFSBG

Manufacturer
Broadcom
Description
CABLE MODEM
Catalog
Embedded - System On Chip (SoC)
Availability
010101 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 29 - Dec 03 2024
Type Description
Series:*
Package:Tray
Part Status:Obsolete
Architecture:-
Core Processor:-
Flash Size:-
RAM Size:-
Peripherals:-
Connectivity:-
Speed:-
Primary Attributes:-
Operating Temperature:-
Package / Case:-
Supplier Device Package:-
BCM3384DIFSBG is available at GangBo-ic.com, Please review product page below for detailed information, including BCM3384DIFSBG price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BCM3384DIFSBG to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

  • Please confirm the specifications of the products when ordering.
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  • BCM3384DIFSBG Price
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