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B32529E6154M000

B32529E6154M000

CAP FILM 0.15UF 20% 400VDC RAD

MCV-X6DB

MCV-X6DB

SOM CYCLONEV SOC-FPGA

321-50190

321-50190

HEATSHRINK 3.5:1 19MMX1M 1=10/PK

MCV-X6DB

MCV-X6DB

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Part No :

MCV-X6DB

Manufacturer
ARIES Embedded
Description
SOM CYCLONEV SOC-FPGA
Catalog
Embedded - Microcontroller, Microprocessor, FPGA Modules
Availability
914591 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
Type Description
Series:-
Package:Box
Part Status:Active
Module/Board Type:MPU, FPGA Core
Core Processor:ARM® Cortex®-A9
Co-Processor:-
Speed:800MHz
Flash Size:4GB
RAM Size:1GB
Connector Type:Board-to-Board (BTB) Socket - 360
Size / Dimension:2.91" x 1.65" (74mm x 42mm)
Operating Temperature:-40°C ~ 85°C
MCV-X6DB is available at GangBo-ic.com, Please review product page below for detailed information, including MCV-X6DB price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for MCV-X6DB to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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