RES SMD 205 OHM 0.05% 1/4W 1206
IC FPGA 252 I/O 676FBGA
BIG CHIP LED HB MODULE BLUE
CONN PCMCIA CARD PUSH-PULL R/A
Type | Description |
---|---|
Series: | Fusion® |
Package: | Tray |
Part Status: | Active |
Number of LABs/CLBs: | - |
Number of Logic Elements/Cells: | - |
Total RAM Bits: | 276480 |
Number of I/O: | 252 |
Number of Gates: | 1500000 |
Voltage - Supply: | 1.425V ~ 1.575V |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 676-BGA |
Supplier Device Package: | 676-FBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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