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IDT71P74604S200BQG8

IDT71P74604S200BQG8

IC SRAM 18MBIT PARALLEL 165CABGA

A17883-07

A17883-07

TFLEX HD81750 9" X 9"

A17883-07

A17883-07

Image is for reference, please contact us to get the real picture

Part No :

A17883-07

Manufacturer
Laird - Performance Materials
Description
TFLEX HD81750 9" X 9"
Catalog
Thermal - Pads, Sheets
Availability
543254 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 28 - Dec 02 2024
Type Description
Series:Tflex™ HD80000
Package:Bulk
Part Status:Active
Usage:-
Type:Gap Filler Pad, Sheet
Shape:Square
Outline:228.60mm x 228.60mm
Thickness:0.0700" (1.778mm)
Material:Silicone, Ceramic Filled
Adhesive:-
Backing, Carrier:Liner
Color:Teal
Thermal Resistivity:-
Thermal Conductivity:6.0W/m-K
A17883-07 is available at GangBo-ic.com, Please review product page below for detailed information, including A17883-07 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for A17883-07 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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