THERM PAD 228.6MMX228.6MM PINK
IC SRAM 4MBIT PARALLEL 44TSOP2
Type | Description |
---|---|
Series: | Tflex™ HD700 |
Package: | Box |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 228.60mm x 228.60mm |
Thickness: | 0.150" (3.81mm) |
Material: | Silicone, Ceramic Filled |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | - |
Color: | Pink |
Thermal Resistivity: | - |
Thermal Conductivity: | 5.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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