Type | Description |
---|---|
Series: | Tflex™ B200 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 457.20mm x 457.20mm |
Thickness: | 0.150" (3.81mm) |
Material: | Silicone, Ceramic Filled |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | - |
Color: | Gray |
Thermal Resistivity: | - |
Thermal Conductivity: | 2.0W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
40101005Würth Elektronik Midcom |
WE-TGF THERMAL GAP FILLER PAD RE |
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