25X32.5MM HEATSINK ASSEMBLY
Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Cylindrical |
Length: | - |
Width: | - |
Diameter: | 1.250" (31.75mm) OD |
Fin Height: | 0.600" (15.24mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 5.49°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 12.20°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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