RES SMD 430K OHM 1% 3/4W 1210
HEATSINK 70X70X25MM XCUT T766
IC DRAM 2GBIT PARALLEL 96VFBGA
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.756" (70.00mm) |
Width: | 2.756" (70.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 2.18°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ATS-13C-204-C2-R0Advanced Thermal Solutions, Inc. |
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ATS-14A-158-C1-R0Advanced Thermal Solutions, Inc. |
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ATS-04G-105-C1-R1Advanced Thermal Solutions, Inc. |
HEATSINK 45.00MM X 45.00MM ALUM |
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ATS-02C-110-C2-R1Advanced Thermal Solutions, Inc. |
HEATSINK 54.00MM X 54.00MM ALUM |