CONN IC DIP SOCKET 4POS GOLD
IC MCU 8BIT MICOM
Type | Description |
---|---|
Series: | 508 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.2" (5.08mm) Row Spacing |
Number of Positions or Pins (Grid): | 4 (2 x 2) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6 |
Operating Temperature: | -55°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
551-10-175-16-005005Mill-Max |
CONN HDR SOLDRTL |
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510-91-084-11-045002Mill-Max |
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614-91-428-31-018000Mill-Max |
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36-6574-16Aries Electronics, Inc. |
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510-93-088-12-052001Mill-Max |
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29-0518-11Aries Electronics, Inc. |
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522-13-145-17-001002Mill-Max |
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614-43-304-41-001000Mill-Max |
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514-83-068-10-001117Preci-Dip |
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522-13-100-13-062003Mill-Max |
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511-91-085-13-042002Mill-Max |
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