CAP FILM 0.22UF 5% 50VDC RADIAL
CONN IC DIP SOCKET 18POS GOLD
Type | Description |
---|---|
Series: | - |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Thermoplastic, Polyester |
Operating Temperature: | -40°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
110-87-422-41-105101Preci-Dip |
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299-83-624-10-002101Preci-Dip |
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123-43-632-41-001000Mill-Max |
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24-4518-10Aries Electronics, Inc. |
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243-18-1-03CnC Tech |
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25-0503-30Aries Electronics, Inc. |
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