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28-6574-11

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Part No :: 28-6574-11

Manufacturer: Aries Electronics, Inc.

Description: CONN IC DIP SOCKET ZIF 28POS TIN

Catalog: Sockets for ICs, Transistors

Availability: 650965 pieces

Shipped from: HK warehouse

Expected Shipping Date: Feb 24 - Feb 28 2025

PDF: 28-6574-11 PDF

Type	Description
Series:	57
Package:	Bulk
Part Status:	Active
Type:	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):	28 (2 x 14)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Tin
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Beryllium Copper
Housing Material:	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:	-

28-6574-11 is available at GangBo-ic.com, Please review product page below for detailed information, including 28-6574-11 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 28-6574-11 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

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