CONTACT SPRING LOADED SLDR CUP
M-SFP-BIDI-BUNDLE LX/LC EEC
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Contact Type: | Sleeve & Plunger (Pogo Pins) |
Mounting Type: | Through Hole, Solder Cup |
Maximum Working Height: | 0.343" (8.72mm) |
Recommended Working Height: | 0.298" (7.58mm) |
Minimum Working Height: | 0.253" (6.43mm) |
Pad Layout Dimension: | Circular - 0.078" (1.98mm) (TH) |
Operating Force - Initial: | 25gf |
Operating Force - Mid Compression: | 60gf |
Plunger Size: | 0.042" (1.07mm) Dia |
Features: | - |
Mating Cycles: | 1000000 |
Contact Material: | Copper Alloy |
Contact Finish: | Gold |
Contact Finish Thickness: | 20.0µin (0.51µm) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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