HEATSINK STAMP 19.4X25.4X11.4MM
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | TO-263 (D²Pak) |
Attachment Method: | SMD Pad |
Shape: | Rectangular, Fins |
Length: | 0.763" (19.38mm) |
Width: | 1.000" (25.40mm) |
Diameter: | - |
Fin Height: | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise: | 1.5W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | - |
Material: | Copper |
Material Finish: | Tin |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
7-311-BACTS Corporation |
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