HEATSINK STAMP 25.9X15X9.5MM
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | TO-263 (D²Pak) |
Attachment Method: | SMD Pad |
Shape: | Rectangular, Fins |
Length: | 0.590" (15.00mm) |
Width: | 1.020" (25.91mm) |
Diameter: | - |
Fin Height: | 0.375" (9.52mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | - |
Material: | Copper |
Material Finish: | Tin |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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