CONN IC DIP SOCKET 10POS GOLD
Type | Description |
---|---|
Series: | Lo-PRO®file, 513 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 10 (2 x 5) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
410-87-224-10-002101Preci-Dip |
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110-93-324-41-605000Mill-Max |
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110-87-636-41-005101Preci-Dip |
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123-83-636-41-001101Preci-Dip |
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240-5205-013M |
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917-87-210-41-005101Preci-Dip |
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917-83-103-41-053101Preci-Dip |
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346-93-107-41-013000Mill-Max |
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20-3518-102Aries Electronics, Inc. |
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