SOLDER PASTE WATER SOLUBLE 35GM
STRAP STR RELIEF FOR DIP 16 CONN
Type | Description |
---|---|
Series: | R500 |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
Flux Type: | Water Soluble |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
SMDSWLF.020 .4OZChip Quik, Inc. |
LF SOLDER WIRE POCKET PACK 96.5/ |
|
SMD2SW.020 2OZChip Quik, Inc. |
SOLDER WIRE 60/40 TIN/LEAD NO-CL |
|
RASW.031 1LBChip Quik, Inc. |
SOLDER WIRE 63/37 TIN/LEAD ROSIN |
|
WBRA633720-2OZSRA Soldering Products |
WIRE SOLDER , ROSIN ACTIVATED, 6 |
|
RASW.020 .4OZChip Quik, Inc. |
SOLDER WIRE POCKET PACK 63/37 TI |
|
SMDSWLF.031 4OZChip Quik, Inc. |
SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. |
|
SMDLTLFPT4Chip Quik, Inc. |
SOLDER PASTE NO CLEAN SN42/BI57. |
|
4901-227GMG Chemicals |
SOLDER LF SN99 21GAUGE.5LBS |
|
TS391AX500CChip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
|
4901-454GMG Chemicals |
SOLDER LF SN99 21GAUGE 1LBS |
|
NC191LT35T5Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
SMDSW.020 4OZChip Quik, Inc. |
SOLDER WIRE NO-CLEAN 63/37 4OZ. |
|
24-9574-1400Kester |
SOLDER 66 .062 14AWG 1LB |