SOLDER PASTE NO CLEAN 500GM
Type | Description |
---|---|
Series: | NP505-HR |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
SMD4300AX250T5Chip Quik, Inc. |
SOLDER PASTE SN63/PB37 250G T5 |
|
SMDSWLF.015 2OZChip Quik, Inc. |
LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
|
24-6040-0066Kester |
SOLDER RA FLUX 11AWG 60/40 1LB |
|
24-6040-9721Kester |
SOLDER FLUX-CORED/285 .062" 1LB |
|
SMD291SNL500T4CChip Quik, Inc. |
SOLDER PASTE SAC305 T4 500G |
|
92-7080-0018Kester |
SOLDER FLUX-CORED/44 .025" 500G |
|
24-7068-6403Kester |
SOLDER WATER SOL .031" 20AWG 1LB |
|
EXB-SN96AG4Chip Quik, Inc. |
SOLDER BAR SN96/AG4 1LB (454G) E |
|
SMDAG100-S-0.25Chip Quik, Inc. |
SOLDER SHOT AG100 0.25OZ 7G |
|
NC191LT250Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
NC191AX15T5Chip Quik, Inc. |
SMOOTH FLOW LEADED SOLDER PASTE |
|
24-6337-9727Kester |
SOLDER FLUX-CORED/285 63/37 .015 |
|
70-1506-1710Kester |
SOLDER PASTE NO CLEAN 500GM |