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TS391LT250

TS391LT250

THERMALLY STABLE SOLDER PASTE NO

TS391LT250

TS391LT250

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Part No :

TS391LT250

Manufacturer
Chip Quik, Inc.
Description
THERMALLY STABLE SOLDER PASTE NO
Catalog
Solder
Availability
267026 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 23 - Nov 27 2024
PDF
TS391LT250 PDF
Type Description
Series:-
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter:-
Melting Point:281°F (138°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 8.8 oz (250g)
Shelf Life:12 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:68°F ~ 77°F (20°C ~ 25°C)
TS391LT250 is available at GangBo-ic.com, Please review product page below for detailed information, including TS391LT250 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for TS391LT250 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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