SMOOTH FLOW LEAD-FREE SOLDER PAS
Type | Description |
---|---|
Series: | Smooth Flow™ |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 422 ~ 428°F (217 ~ 220°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 1.76 oz (50g) |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
04-6337-0030Kester |
SOLDER SN63PB37 ULD BAR 1 2/3 LB |
![]() |
24-6337-8800Kester |
SOLDER NO-CLEAN 20AWG 1LB |
![]() |
4896-454GMG Chemicals |
SOLDER RA 60/40 .040" 1 LB |
![]() |
92-6337-8872Kester |
SOLDER FLUX-CORED/245 63/37 .047 |
![]() |
70-1903-0819Kester |
SOLDER PASTE WATER SOLUBLE 750GM |
![]() |
SMD3SW.031 2OZChip Quik, Inc. |
SOLDER WIRE 62/36/2 TIN/LEAD/SIL |
![]() |
SMD291SNL40T7Chip Quik, Inc. |
SOLDER PASTE IN JAR 40G (T7) SAC |
![]() |
25-7068-0674Kester |
SOLDER FLUX-CORED/OR421 .086 4 L |
![]() |
TS391LT50Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
![]() |
NC3SW.031 0.5OZChip Quik, Inc. |
SOLDER WIRE MINI POCKET PACK 62/ |
![]() |
92-6040-8800Kester |
SOLDER FLUX-CORED/245 .031" 500G |
![]() |
92-7068-6406Kester |
SOLDER FLUX-CORED/331.0240" 500G |
![]() |
24-6337-0060Kester |
SOLDER FLUX-CORED/44 63/37 .062" |