SOLDER PASTE 63/37 T4 500G
Type | Description |
---|---|
Series: | - |
Package: | Cartridge |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | Water Soluble |
Wire Gauge: | - |
Process: | Leaded |
Form: | Cartridge, 17.64 oz (500g) |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
TS391LT10Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
|
WBNCC633720-4OZSRA Soldering Products |
NO-CLEAN FLUX CORE SOLDER, 63/37 |
|
NC191LTA15T5Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
|
24-7070-0060Kester |
SOLDER FLUX-CORED/44 .062" 1LB S |
|
CWSN60 NCCW2.2 .015Amerway Inc. |
SN60PB40 NCCW2.2% .015 !# SPL |
|
CWSN99.3 WRAP3.015Amerway Inc. |
SN99.3/CU.7 WRAP3 .015 1# SPL |
|
24-7068-6409Kester |
SOLDER WATER SOL .050" 16AWG 1LB |
|
SMD291AXT5Chip Quik, Inc. |
SOLDER PASTE NO CLEAN 63SN/37PB |
|
SMDAL200Chip Quik, Inc. |
ALUMINUM SOLDER PASTE WATER-SOLU |
|
SMD291SNL250T5Chip Quik, Inc. |
SOLDER PASTE SAC305 250G T5 |
|
SSLTNC-250GSRA Soldering Products |
LOW TEMPERATURE LEAD FREE SOLDER |
|
70-0102-0511Kester |
SOLDERPASTE NO CLEAN 63/37 600GM |
|
24-7340-9713Kester |
SOLDER FLUX-CORED/285 .031" 1LB |