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SMD291SNL500T3

SMD291SNL500T3

SOLDER PASTE SAC305 500G

SMD291SNL500T3

SMD291SNL500T3

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Part No :

SMD291SNL500T3

Manufacturer
Chip Quik, Inc.
Description
SOLDER PASTE SAC305 500G
Catalog
Solder
Availability
366936 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 24 - Nov 28 2024
PDF
SMD291SNL500T3 PDF
Type Description
Series:-
Package:Jar
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 428°F (217 ~ 220°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 17.64 oz (500g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:37°F ~ 46°F (3°C ~ 8°C)
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GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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