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TC1-200G

TC1-200G

HEAT SINK COMPOUND - HIGH DENSIT

TC1-200G

TC1-200G

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Part No :

TC1-200G

Manufacturer
Chip Quik, Inc.
Description
HEAT SINK COMPOUND - HIGH DENSIT
Catalog
Thermal - Adhesives, Epoxies, Greases, Pastes
Availability
483448 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 22 - Nov 26 2024
Type Description
Series:-
Package:Bulk
Part Status:Active
Type:Silicone Compound
Size / Dimension:200 gram Jar
Usable Temperature Range:-
Color:White
Thermal Conductivity:0.67W/m-K
Features:-
Shelf Life:60 Months
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)
TC1-200G is available at GangBo-ic.com, Please review product page below for detailed information, including TC1-200G price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for TC1-200G to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

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Phone: 00852-52612101

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