RESARRAYA 4X0603 22R 5% 63MW CON
BOARD LEVEL HEAT SINK
MICROPHONE BOOM ASSEMBLY
THERM PAD 25.4MMX19.05MM BLACK
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.180" (29.97mm) |
Width: | 1.000" (25.40mm) |
Diameter: | - |
Fin Height: | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 300 LFM |
Thermal Resistance @ Natural: | 12.50°C/W |
Material: | Copper |
Material Finish: | Tin |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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