THERMAL INTERFACE PAD, GAP PAD,
STANDARD GROUND LEAD
IC FPGA 162 I/O 256UBGA
Type | Description |
---|---|
Series: | λGEL™ COH |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gel Pad, Sheet |
Shape: | Square |
Outline: | 400.00mm x 400.00mm |
Thickness: | 0.0390" (0.991mm) |
Material: | Silicone Gel |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | - |
Color: | Gray |
Thermal Resistivity: | - |
Thermal Conductivity: | 8.2W/m-K |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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